OIP Introduction – An Optical-in-Package Solution

  • More and more Optical package used in mobile.
  • Traditional package mainly used in optical.
  • OIP cutting edge technology: Optical in Package
    • Integrated optical sensor and various lens module
    • Super thin optical package, below 0.4mm.
    • Excellent reliability for mobile and automotive


Optical module Special substrate 4 -side protection
– Silicon Photonics module with unique fiber edge coupling assembly
– Optical sensor module
– Thin LED package
– Co-package substrate with glass light guide
– Low CTE substrate at 6ppm
– 4-side chip protection.
– 4-side glass filter protection.
– Low UV transmission

Technology Trend