OIP Introduction – An Optical-in-Package Solution
- More and more Optical package used in mobile.
- Traditional package mainly used in optical.
- OIP cutting edge technology: Optical in Package
- Integrated optical sensor and various lens module
- Super thin optical package, below 0.4mm.
- Excellent reliability for mobile and automotive
Technology
| Optical module | Special substrate | 4 -side protection |
|---|---|---|
| – Silicon Photonics module with unique fiber edge coupling assembly – Optical sensor module – Thin LED package | – Co-package substrate with glass light guide – Low CTE substrate at 6ppm | – 4-side chip protection. – 4-side glass filter protection. – Low UV transmission |
Technology Trend
-01–
Single chip & Multi-chip
- Single side package
- Simple electronic package
-02-
InFO_PoP
- Move towards 3D package
- TMV to replace TSV
- Integrated logic, memory, wireless chips
-03-
Optical-electronic sensor & Photonics package
- Integrated optical and electronics device
- Enable Optical-in-Package system
- Lager density chips, >100 chips