Products and Services
Photonics Package
Photonics module package
- High density of fiber optical channel
- Edge coupling connection.
- Chip-chip gap down to 0.1mm
Co-package substrate
- Innovated embedded glass guide
- Excellent signal loss control
Under-Display Finger ID Module
Thin package
- No glass protection required
- Thickness down to 0.25 mm
- No substrate
Optical sensor
Super Thin Optical Module
- Chip/glass embedded in IR black material
- Thin package, thickness down to 0.25 mm
- Advanced packaging. no air vent required.
4-side protection glass
- Glass or lens embedded
- IR black material
- thickness same to glass
- Excellent adhesion