Products and Services

Photonics Package

Photonics module package

  • High density of fiber optical channel
  • Edge coupling connection.
  • Chip-chip gap down to 0.1mm

Co-package substrate

  • Innovated embedded glass guide
  • Excellent signal loss control

Under-Display Finger ID Module

Thin package

  • No glass protection required
  • Thickness down to 0.25 mm
  • No substrate

Optical sensor

Super Thin Optical Module

  • Chip/glass embedded in IR black material
  • Thin package, thickness down to 0.25 mm
  • Advanced packaging. no air vent required.

4-side protection glass

  • Glass or lens embedded
  • IR black material
  • thickness same to glass
  • Excellent adhesion